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一种双层微流控芯片，韩琳，强乐，张宇，刘宏，王敏，ZL2020211236729，2021-02-19
  • Affilication of Author(s):
    山东大学
  • First Author:
    hanlin
  • Disigner of the Invention:
    hanlin,王敏,刘宏,张宇,强乐,hanlin
  • Type of Patent:
    Utility models
  • State of Patent:
    授权
  • Application Number:
    2020211236729
  • Authorization number:
    ZL2020211236729
  • Number of Inventors:
    5
  • Service Invention or Not:
    no
  • Application Date:
    2020-06-17
  • Authorization Date:
    2021-02-19

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