yangchunfeng

Personal Information:

Gender:Female
Date of Employment:2003-07-16

VIEW MORE
Home > Scientific Research > Paper Publications

Influences of hard inclusions on processing stress in diamond multi-wire sawing multi-crystalline silicon

Date of Publication:2022-06-15 Hits:

Affiliation of Author(s):机械工程学院
Journal:Materials Science in Semiconductor Processing
First Author:程大猛
Document Code:CC396E8598334DB69377C1DD2EC1B832
Issue:144
Page Number:106602
Number of Words:8
Translation or Not:no
Date of Publication:2022-06-15

Pre One:Simulation analysis of cutting coolant flow field in fixed and free abrasive combined wire sawing polysilicon

Next One:Wet sandblasting pretreatment of diamond wire sawn multi-crystalline silicon wafer for surface acid texturization in photovoltaics

Copyright All Rights Reserved Shandong University Address: No. 27 Shanda South Road, Jinan City, Shandong Province, China: 250100
Information desk: (86) - 0531-88395114
On Duty Telephone: (86) - 0531-88364731 Construction and Maintenance: Information Work Office of Shandong University

Click:  | The Last Update Time:..  | Login | SDU