Research Projects

高性能物联网晶振基片关键技术研究

Release time::2022-05-26|Hits:

Affiliation of Participant(s):晶体材料研究院

Leading Scientist:于法鹏

Nature of Project:横向

Project Number:B93DFBCDA91166ACE053BE07C2CA8C0C

Date of Project Approval:2020-01-01

Scheduled completion time:2022-12-19

Date of Project Completion:2022-12-19

Date of Project Initiation:2020-01-01