毕文波
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Gender:Male
Education Level:Postgraduate (Doctoral)
Alma Mater:山东大学
Paper Publications
- [71] GE PEI QI , biwenbo and 段德荣. Numerical study on the heat transfer enhancement and fatigue life by flow-induced vibration. CHEMICAL ENGINEERING RESEARCH & DESIGN, 132, 652, 2018.
- [72] GE PEI QI , biwenbo and 季家东. Numerical analysis of shell-side flow-induced vibration of elastic tube bundle in heat exchanger. JOURNAL OF HYDRODYNAMICS, 30, 249, 2018.
- [73] zhuhongtao , huangchuanzhen , biwenbo and 葛梦然. Investigation on critical crack-free cutting depth for single crystal silicon slicing with fixed abrasive wire saw based on the scratching machining experiments. Materials Science in Semiconductor Processing, 74, 261, 2018.
- [74] GE PEI QI , biwenbo , gaoyufei and 王沛志. Stress analysis in scratching of anisotropic single-crystal silicon carbide. International Journal of Mechanical Sciences, 141, 1, 2018.
- [75] GE PEI QI , biwenbo and 王沛志. Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide. Engineering fracture mechanics, 184, 273, 2017.
- [76] gaoyufei , GE PEI QI , biwenbo and 葛梦然. A finite element analysis of sawing stress in fixed-abrasive wire saw slicing KDP crystal. international Journal of Advanced Manufacturing Technology, 91, 2049, 2017.
- [77] GE PEI QI , gaoyufei , biwenbo and 王沛志. Prediction of sawing force for single-crystal silicon carbide with fixed abrasive diamond wire saw. Materials Science in Semiconductor Processing, 63, 25, 2017.
- [78] GE PEI QI , gaoyufei , biwenbo and 刘腾云. Depth of cut for single abrasive and cutting force in resin bonded diamond wire sawing. international Journal of Advanced Manufacturing Technology, 88, 1763, 2017.
- [79] GE PEI QI , biwenbo and 段德荣. Numerical investigation on the heat transfer enhancement mechanism of planar elastic tube bundle by flow-induced vibration. International Journal of Thermal Sciences, 112, 450, 2017.
- [80] GE PEI QI , biwenbo and 刘腾云. Prediction of the thickness for silicon wafers sawn by diamond wire saw. Materials Science in Semiconductor Processing, 71, 133, 2017.