Strain rate effect on material deformation and removal behavior during high speed scratching of 4H‐SiC
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Institution:机械工程学院
Title of Paper:Strain rate effect on material deformation and removal behavior during high speed scratching of 4H‐SiC
Journal:Tribology International
First Author:张瑞豪
Document Code:4C8DA055C69F433E9763B881893D0771
Volume:187
Issue:1
Page Number:108756
Number of Words:5
Translation or Not:No
Date of Publication:2023-09
Release Time:2025-02-15