山东大学教师主页程勇 Molecular Dynamics Simulation of the Cu3Sn/Cu Interfacial Diffusion Mechanism under Electrothermal Coupling Home

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School/Department:核科学与能源动力学院

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Molecular Dynamics Simulation of the Cu3Sn/Cu Interfacial Diffusion Mechanism under Electrothermal Coupling

Release Time:2024-05-18 | Hits:

Title of Paper:Molecular Dynamics Simulation of the Cu3Sn/Cu Interfacial Diffusion Mechanism under Electrothermal Coupling

Journal:Materials

First Author:何志伟

Document Code:1747173425751875586

Volume:16

Issue:24

Number of Words:4

Translation or Not:No

Date of Publication:2023-12