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School/Department:能源与动力工程学院

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程勇

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Paper Publications

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Molecular Dynamics Simulation of the Cu3Sn/Cu Interfacial Diffusion Mechanism under Electrothermal Coupling
Date of Publication:2023-12-01 Hits:

Affiliation of Author(s):能源与动力工程学院
Journal:Materials
First Author:何志伟
Document Code:1747173425751875586
Volume:16
Issue:24
Number of Words:4
Translation or Not:no
Date of Publication:2023-12-01
Date of Publication:2023-12-01

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