山东大学教师主页程勇 Reliability and thermal fatigue life prediction of solder joints using nanoindentation Home

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School/Department:核科学与能源动力学院

Gender:Male

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Reliability and thermal fatigue life prediction of solder joints using nanoindentation

Release Time:2024-05-21 | Hits:

Title of Paper:Reliability and thermal fatigue life prediction of solder joints using nanoindentation

Journal:Materials Today Communications

First Author:曹杰

Document Code:07E2C4028B3B492AAF0C67FBCF11D3C9

Issue:39

Number of Words:4

Translation or Not:No

Date of Publication:2024-06