Release Time:2025-05-27 |
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Gender:Male
Paper Publications
Reliability and thermal fatigue life prediction of solder joints using nanoindentation
Institution:核科学与能源动力学院
Title of Paper:Reliability and thermal fatigue life prediction of solder joints using nanoindentation
Journal:Materials Today Communications
First Author:曹杰
Document Code:1794987513578307585
Volume:39
Number of Words:4
Translation or Not:No
Date of Publication:2025-04