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Degree:Doctor
Status:Employed
School/Department:未来技术学院

Chen Mengjun

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Gender:Male

Education Level:Postgraduate (Doctoral)

Alma Mater:山东大学

Patents

Current position: Home / Scientific Research / Patents
一种用于TBM隧道衬砌背后充填的低碳抗渗注浆材料及其制备方法
Release Time:2023-09-27 | Hits:

Institution:土建与水利学院

Type of Patent:Invent

Application Number:202211287281.4

Number of Inventors:4

Service Invention or Not:No

Application Date:2022-10-20

Publication Date:2023-09-05

Authorization Date:2023-09-05