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Project Name:基于TSV的3D集成电路芯片和系统自驱动协同散热技术研发

Institution:热科学与工程研究中心

Leading Scientist:王鑫煜

Supported by:2019 Shandong Provincial Key R&D Program (Public Welfare Technology Development)

Nature of Project:纵向

Project Level:省、部委级

Project Participants:王鑫煜,辛公明,陈岩

Project Number:937F2165707A79FBE053BE07C2CA2C20

Project Approval Number:2019GGX101030

Date of Project Approval:2019-07-08

Scheduled Completion Time:2021-12-31

Date of Project Completion:2021-12-31

Date of Project Initiation:2019-01-01

Release Time:2020-03-21