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一种模拟多孔介质的微流控芯片及其制作方法
Release Time:2025-09-16
  • Type of Patent:
    Invent
  • Application Number:
    202311100809.7
  • Number of Inventors:
    5
  • Service Invention or Not:
    No
  • Application Date:
    2023-08-29
  • Publication Date:
    2025-08-01
  • Authorization Date:
    2025-08-01
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