Doctoral Degree in Engineering

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西安交通大学

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Date of Employment:2023-06
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Home > Scientific Research > Paper Publications

Numerical study on the effect of thermal pad on enhancing interfacial heat transfer considering thermal contact resistance

Release Time:2023-12-07 Hits:

Institution:高等技术研究院
Journal:Case Studies in Thermal Engineering
Document Code:1689830657891184641
Volume:49
Number of Words:4
Translation or Not:No
Date of Publication:2023-09

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