中文

一种二维硅的制备方法及应用

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  • Affilication of Author(s):材料科学与工程学院

  • Type of Patent:发明

  • Application Number:202211174080.3

  • Number of Inventors:1

  • Service Invention or Not:no

  • Application Date:2022-09-26

  • Publication Date:2023-06-30

  • Authorization Date:2023-06-30

  • Publication Date:2023-06-30

  • Application Date:2022-09-26

  • Authorization Date:2023-06-30

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