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Title:一种考虑温度效应的孔隙介质注浆试验系统及方法
Type of Patent:Invent
Application Number:202311705174.3
Number of Inventors:3
Service Invention or Not:No
Application Date:2023-12-11
Publication Date:2024-08-30
Authorization Date:2024-08-30
Release Time:2024-09-05