Title : Simulation Study on Nondestructive Testing of Winding Hot Spot Temperature Based on Ultrasonic Emission

Hits :

Affiliation of Author(s):电气工程学院

Title of Paper:Simulation Study on Nondestructive Testing of Winding Hot Spot Temperature Based on Ultrasonic Emission

Journal:IEEE Transactions on dielectrics and electrical insulation

First Author:孙优良

Document Code:905C3008B4E64A3A90A3346E558232C2

Volume:31

Issue:4

Page Number:2179

Number of Words:5

Translation or Not:no

Date of Publication:2024-08-29