Paper Publications
Title of Award : Simulation Study on Nondestructive Testing of Winding Hot Spot Temperature Based on Ultrasonic Emission
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Institution:电气工程学院
Title of Paper:Simulation Study on Nondestructive Testing of Winding Hot Spot Temperature Based on Ultrasonic Emission
Journal:IEEE Transactions on dielectrics and electrical insulation
First Author:孙优良
Document Code:905C3008B4E64A3A90A3346E558232C2
Volume:31
Issue:4
Page Number:2179
Number of Words:5
Translation or Not:No
Date of Publication:2024-08
Release Time:2024-10-09