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基于n-型有机半导体晶体表面台阶缺陷的修复方法及应用
2021-11-12 Hits:
Affilication of Author(s):晶体材料研究院
Type of Patent:发明
Application Number:202010377063.4
Number of Inventors:1
Service Invention or Not:no
Application Date:2020-05-07
Publication Date:2021-11-19
Authorization Date:2021-11-19
Publication Date:2021-11-19
Application Date:2020-05-07
Authorization Date:2021-11-19
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