中文

Interface Schottky barrier engineering via strain in metal-semiconductor composites.

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  • Affiliation of Author(s):物理学院

  • Journal:NANOSCALE

  • All the Authors:yulin,Huang Baibiao

  • First Author:Dai Ying

  • Indexed by:Unit Twenty Basic Research

  • Document Code:lw-173779

  • Volume:8

  • Page Number:1352

  • Translation or Not:no

  • Date of Publication:2016-01-07

  • Date of Publication:2016-01-07

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