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Research Projects
PCB压合过程应力仿真
Release Time:2022-05-26| Hits:
Project Name:PCB压合过程应力仿真
Institution:材料科学与工程学院
Leading Scientist:贾玉玺
Nature of Project:横向
Project Number:B32C25D6A5F07BE4E053BE07C2CAADFF
Date of Project Approval:2020-09-22
Scheduled Completion Time:2021-09-21
Date of Project Completion:2021-09-21
Date of Project Initiation:2020-09-22
Release Time:2022-05-26
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