贾玉玺
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Paper Publications
Reactive Mold Filling in Resin Transfer Molding Processes with Edge Effects
Release Time:2019-04-14| Hits:
Institution:材料科学与工程学院
Title of Paper:Reactive Mold Filling in Resin Transfer Molding Processes with Edge Effects
Journal:Journal of applied polymer science
First Author:贾玉玺
All the Authors:孙胜
Document Code:lw-88588
Volume:113
Issue:6
Page Number:3815
Translation or Not:No
Date of Publication:2009-09
Release Time:2019-04-14
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