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一种减小PCB压合后翘曲变形的温度优化设计方法及系统
Release Time:2023-09-06| Hits:
Title:一种减小PCB压合后翘曲变形的温度优化设计方法及系统
Institution:材料科学与工程学院
Type of Patent:Invent
Application Number:202111603892.0
Number of Inventors:1
Service Invention or Not:No
Application Date:2021-12-24
Publication Date:2023-07-25
Authorization Date:2023-07-25
Release Time:2023-09-06
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