贾玉玺
Click:
The Last Update Time:..
Patents
一种减小PCB压合后翘曲变形的温度优化设计方法及系统
2023-09-06 Hits:
Affilication of Author(s):材料科学与工程学院
Type of Patent:发明
Application Number:202111603892.0
Number of Inventors:1
Service Invention or Not:no
Application Date:2021-12-24
Publication Date:2023-07-25
Authorization Date:2023-07-25
Publication Date:2023-07-25
Application Date:2021-12-24
Authorization Date:2023-07-25
Copyright All Rights Reserved Shandong University Address: No. 27 Shanda South Road, Jinan City, Shandong Province, China: 250100
Information desk: (86) - 0531-88395114
On Duty Telephone: (86) - 0531-88364731 Construction and Maintenance: Information Work Office of Shandong University