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PCB用玻纤布经/纬纱铺排方向优化设计方法及系统
Release Time:2025-07-16| Hits:
Title:PCB用玻纤布经/纬纱铺排方向优化设计方法及系统
Institution:材料科学与工程学院
Type of Patent:Invent
Application Number:202111603889.9
Number of Inventors:1
Service Invention or Not:No
Application Date:2021-12-24
Publication Date:2025-03-25
Authorization Date:2025-03-25
Release Time:2025-07-16
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