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PCB用玻纤布经/纬纱铺排方向优化设计方法及系统
2025-07-16 Hits:
Affilication of Author(s):材料科学与工程学院
Type of Patent:发明
Application Number:202111603889.9
Number of Inventors:1
Service Invention or Not:no
Application Date:2021-12-24
Publication Date:2025-03-25
Authorization Date:2025-03-25
Publication Date:2025-03-25
Application Date:2021-12-24
Authorization Date:2025-03-25
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