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通过地面钻孔向地层空洞内填充骨料的装置及工艺
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Title:通过地面钻孔向地层空洞内填充骨料的装置及工艺

Institution:岩土与地下工程研究院

Type of Patent:Invent

Application Number:201210018919.4

Number of Inventors:1

Service Invention or Not:No

Application Date:2012-01-20

Publication Date:2014-06-18

Authorization Date:2014-06-18

Release Time:2019-04-15

Personal information

Professor of Application

Gender : Male

Status : Employed

School/Department : 土建与水利学院

Date of Employment : 2006-10-18

Faculty/School : School of Civil Engineering

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