Affilication of Author(s):机械工程学院
Type of Patent:发明
Application Number:202110013700.4
Number of Inventors:3
Service Invention or Not:no
Application Date:2021-01-06
Publication Date:2022-03-08
Authorization Date:2022-03-08
Application Date: 2021-01-06
Publication Date: 2022-03-08
Authorization Date: 2022-03-08
李建勇
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Gender:Male
Education Level:With Certificate of Graduation for Study as Master's Candidates
Alma Mater:山东大学
Patents
利用微流体芯片的特定尺寸陶瓷微颗粒、其制备装置、制备方法和应用
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