Hits:
Title:一种基于近场动力学的裂隙岩体渗流模拟方法及系统
Institution:岩土与地下工程研究院
Type of Patent:Invent
Application Number:202010818578.3
Number of Inventors:4
Service Invention or Not:No
Application Date:2020-08-14
Publication Date:2023-09-05
Authorization Date:2023-09-05
Release Time:2020-08-20
