Title:天-空-地-隧-孔一体化不良地质识别方法及系统
Type of Patent:Invent
Application Number:202211276244.3
Number of Inventors:3
Service Invention or Not:No
Application Date:2022-10-19
Publication Date:2023-03-24
Authorization Date:2023-03-24
Release Time:2023-04-12