Hits:
Title:用于加固软黏土地基的电渗固结试验装置及方法
Institution:岩土与结构工程研究中心
Type of Patent:发明
Application Number:201610231646.X
Number of Inventors:2
Service Invention or Not:No
Application Date:2016-04-14
Publication Date:2018-06-22
Authorization Date:2018-06-22
Release Time:2019-04-15