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Title:一种考虑温度效应的多孔介质注浆模拟方法及系统
Type of Patent:Invent
Application Number:202311722747.3
Number of Inventors:3
Service Invention or Not:No
Application Date:2023-12-15
Publication Date:2024-03-15
Authorization Date:2024-03-15
Release Time:2024-03-29