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Status:Employed
School/Department:未来技术学院

李树忱

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Gender:Male

Patents

Current position: Home / Scientific Research / Patents
一种用于固流耦合模型试验的相似材料
Release Time:2018-12-06 | Hits:

Type of Patent:发明

Application Number:200910017549.0

Number of Inventors:2

Service Invention or Not:No

Application Date:2009-08-05

Publication Date:2012-10-24

Authorization Date:2009-08-05