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School/Department:未来技术学院

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李树忱

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一种用于固流耦合模型试验的相似材料
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Type of Patent:发明
Application Number:200910017549.0
Number of Inventors:2
Service Invention or Not:no
Application Date:2009-08-05
Publication Date:2012-10-24
Authorization Date:2009-08-05
Application Date: 2009-08-05
Publication Date: 2012-10-24
Authorization Date: 2009-08-05

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