Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202210246828.X
Number of Inventors:5
Service Invention or Not:no
Application Date:2022-03-14
Publication Date:2023-06-02
Authorization Date:2023-06-02
Affilication of Author(s):新一代半导体材料研究院
Type of Patent:发明
Application Number:202210246828.X
Number of Inventors:5
Service Invention or Not:no
Application Date:2022-03-14
Publication Date:2023-06-02
Authorization Date:2023-06-02