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The development of transfer technologies for advanced 2D circuits integration.
Release Time:2026-08-27
  • Journal:
    Information & Functional Materials
  • First Author:
    Zhenggang Cai,Liwei Liu
  • Correspondence Author:
    Peng Zhou
  • Issue:
    1
  • Page Number:
    304-312
  • Translation or Not:
    No
  • Date of Publication:
    2024-12
  • Included Journals:
    SCI
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