Paper Publications
Title of Award : Development of fluxes for selected Sn-Cu based lead-free solders
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Institution:材料科学与工程学院
Title of Paper:Development of fluxes for selected Sn-Cu based lead-free solders
Journal:2005 6th International Conference on Electronics Packaging Technology
First Author:杨敏
All the Authors:刘秀忠
Document Code:lw-141719
Page Number:258
Translation or Not:No
Date of Publication:2005-08
Release Time:2019-04-14