Title : Development of fluxes for selected Sn-Cu based lead-free solders

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Affiliation of Author(s):材料科学与工程学院

Title of Paper:Development of fluxes for selected Sn-Cu based lead-free solders

Journal:2005 6th International Conference on Electronics Packaging Technology

All the Authors:liuxiuzhong

First Author:杨敏

Indexed by:Unit Twenty Basic Research

Document Code:lw-141719

Page Number:258

Translation or Not:no

Date of Publication:2005-08-30