刘亚庆
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Supramolecular Luminescent Copper-Nanocluster-Based Dough with Excellent Electrical Conductivity Sensing Properties
  • Affiliation of Author(s):
    国家胶体材料工程技术研究中心
  • Journal:
    ACS Applied Materials & Interfaces
  • Document Code:
    1861302884515287042
  • Volume:
    16
  • Issue:
    43
  • Page Number:
    59327-59335
  • Number of Words:
    4200
  • Translation or Not:
    no
  • Date of Publication:
    2024-10-18

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