李相辉   

Title:Senior Lab Master

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Patents

Title : 二分法裂纹开展的高延性水泥基修复材料设计系统与方法

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Title:二分法裂纹开展的高延性水泥基修复材料设计系统与方法

Affilication of Author(s):土建与水利学院

Type of Patent:发明

Application Number:202310660692.1

Number of Inventors:6

Service Invention or Not:no

Application Date:2023-06-02

Publication Date:2024-02-23

Authorization Date:2024-02-23

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