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有机半导体与金属界面强化传热机理研究及其对有机半导体器件传热的影响

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  • Affiliation of Participant(s):热科学与工程研究中心

  • Leading Scientist:Wang Xinyu

  • Supported by:省科技厅

  • Nature of Project:纵向

  • Project level:省、部委级

  • Project Participants:Wang Xinyu,xingongming,Li Xuefang

  • Project Number:kyxm-69028

  • Project Approval Number:ZR2018BEE025

  • Date of Project Approval:2018-04-01

  • Date of Project Initiation:2018-03-01

  • Scheduled completion time:2020-12-31

  • Date of Project Completion:2020-12-31

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