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Institution:材料科学与工程学院

Title of Paper:Interface microstructure and diffusion mechanism in the diffusion bonding of copper and

Journal:International Journal for the Joining of Materials

First Author:王娟

All the Authors:李亚江,王娟

Document Code:lw-145845

Number of Words:10

Translation or Not:No

Date of Publication:2006-12

Release Time:2019-10-25