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Institution:材料科学与工程学院

Title of Paper:Interface microstructure and diffusion mechanism in the diffusion bonding of copper and aluminum

Journal:International Journal for the Joining of Materials

Key Words:Aluminum;Bonding;Copper;Interfaces (materials);Microstructure;Scanning electron microscopy

First Author:李亚江

Document Code:1395297180587134978

Volume:18

Issue:3-4

Page Number:94-98

Translation or Not:No

Date of Publication:2006-12

Release Time:2025-01-17