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Title:一种C-mount封装半导体激光器集成光纤耦合冷却装置
Institution:信息科学与工程学院
Type of Patent:Utility models
Application Number:2018208199712
Number of Inventors:4
Service Invention or Not:No
Application Date:2018-05-29
Publication Date:2018-12-21
Authorization Date:2018-12-21
Release Time:2019-04-15