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A numerical approximation structured by mixed finite element and upwind fractional step difference for semiconductor device with heat conduction and its numerical analysis
Release Time:2019-10-24| Hits:

Institution:数学学院
Title of Paper:A numerical approximation structured by mixed finite element and upwind fractional step difference for semiconductor device with heat conduction and its numerical analysis
Journal:Numerical Mathematics-Theory Methods and Applications
First Author:袁益让
All the Authors:杨青,李长峰,Tongjun Sun
Document Code:FFB7DA4CDC934CA6B8AE959E6877EC86
Volume:10
Issue:3
Page Number:541-561
Translation or Not:No
Date of Publication:2017-08
Release Time:2019-10-24

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