李长峰

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A numerical approximation structured by mixed finite element and upwind fractional step difference for semiconductor device with heat conduction and its numerical analysis
2017-08-01  Hits:

Affiliation of Author(s):数学学院
Journal:Numerical Mathematics-Theory Methods and Applications
All the Authors:杨青,Li Changfeng,Tongjun Sun
First Author:yuanyirang
Indexed by:Unit Twenty Basic Research
Document Code:FFB7DA4CDC934CA6B8AE959E6877EC86
Volume:10
Issue:3
Page Number:541-561
Translation or Not:no
Date of Publication:2017-08-01
Date of Publication:2017-08-01