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Mathematical model, numerical simulation and convergence analysis of a semiconductor device problem with heat and magnetic influences
Release Time:2024-09-25| Hits:

Title of Paper:Mathematical model, numerical simulation and convergence analysis of a semiconductor device problem with heat and magnetic influences
Journal:Acta Mathematicae Applicatae Sinica, English Series
First Author:李长峰
Correspondence Author:袁益让
All the Authors:宋怀玲
Indexed by:Journal paper
Discipline:Natural Science
First-Level Discipline:Mathematics
Volume:40
Issue:2
Page Number:302-319
Translation or Not:No
Date of Publication:2024-03
Included Journals:SCI
Release Time:2024-09-25

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