Dapper: decompose-and-pack for 3D printing

Release time:2025-05-28|Hits:

Affiliation of Author(s):计算机科学与技术学院

Journal:ACM Transactions on Graphics

First Author:陈学霖

Document Code:lw-172396

Issue:213

Number of Words:10

Translation or Not:no

Date of Publication:2015-11-05