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Dapper: decompose-and-pack for 3D printing
Release Time:2025-05-28
  • Institution:
    计算机科学与技术学院
  • Journal:
    ACM Transactions on Graphics
  • First Author:
    陈学霖
  • Document Code:
    lw-172396
  • Issue:
    213
  • Number of Words:
    10
  • Translation or Not:
    No
  • Date of Publication:
    2015-11
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