Affiliation of Author(s):机械工程学院
Journal:COMPUTERS & GRAPHICS
Key Words:Compressive strength;Elastic moduli;Industrial research;Poisson distribution;Microstructure;Mechanical property;Asymptotic homogenization
First Author:刘培庆
Document Code:C1B3C9AAF42C4CA0BCB56D01DA233C2C
Issue:100
Page Number:106
Number of Words:4
Translation or Not:no
Date of Publication:2021-11-01