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基于蒙皮模型的精确装配仿真方法及系统

Release Time:2020-08-25| Hits:

Title:基于蒙皮模型的精确装配仿真方法及系统

Institution:机械工程学院

Type of Patent:Invent

Application Number:202010717471.X

Number of Inventors:1

Service Invention or Not:No

Application Date:2020-07-23

Publication Date:2024-03-08

Authorization Date:2024-03-08

Release Time:2020-08-25

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