Patents
一种模拟多孔介质的微流控芯片及其制作方法
  • School Sign:
    山东大学
  • Type of Patent:
    Invent
  • State of Patent:
    Pending patent
  • Application Number:
    202311100809.7
  • Number of Inventors:
    8
  • Service Invention or Not:
    no
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