Patents
一种模拟多孔介质的微流控芯片及其制作方法
  • School Sign:
    山东大学
  • First Author:
    Ning Qin
  • Disigner of the Invention:
    Yinglong Zhang,dingxuan,zhaopei,QInglin Chen,Jie Hu,xingongming,wangchengwei
  • Type of Patent:
    Invent
  • State of Patent:
    Pending patent
  • Application Number:
    202311100809.7
  • Number of Inventors:
    8
  • Service Invention or Not:
    no
Copyright All Rights Reserved Shandong University Address: No. 27 Shanda South Road, Jinan City, Shandong Province, China: 250100
Information desk: (86) - 0531-88395114
On Duty Telephone: (86) - 0531-88364731 Construction and Maintenance: Information Work Office of Shandong University