Title:一种基于裂缝多孔介质流体数学模型实现地下流体流动数值模拟的方法、设备及存储介质
Institution:数学学院
Type of Patent:Invent
Application Number:202110387105.7
Number of Inventors:3
Service Invention or Not:No
Application Date:2021-04-08
Publication Date:2022-09-20
Authorization Date:2022-09-20
Release Time:2022-09-23