Title : 后装式组装钻孔系统及其操作方法
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Title:后装式组装钻孔系统及其操作方法
Affilication of Author(s):岩土与结构工程研究中心
Disigner of the Invention:liliping
Application Number:201710013331.2
Number of Inventors:2
Service Invention or Not:no
Application Date:2017-01-09
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