Title of Award : 后装式组装钻孔系统及其操作方法
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Title:后装式组装钻孔系统及其操作方法
Institution:岩土与结构工程研究中心
Type of Patent:发明
Application Number:201710013331.2
Number of Inventors:2
Service Invention or Not:No
Application Date:2017-01-09
Publication Date:2018-08-31
Authorization Date:2018-08-31
Release Time:2019-04-15
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