本人长期从事功率半导体器件（IGBT、SiC、GaN）热状态测试与光纤传感方向的研究。目前共发表SCI/EI论文15篇，授权发明专利2项，主持省部级项目2项。
1. 功率半导体器件结温监测与光纤传感
2. 功率半导体器件状态监测与老化评估
3. 功率半导体器件电-热-应力协同分析
1. A Comparison of Chip Temperature Acquisition Technologies of IGBT Power Modules. IEEE Sensors Journal, 2024.
2. Direct On-Chip IGBT Thermal Sensing Using Adhesive Bonded FBG Sensors. IEEE Sensors Journal, 2023.
3. FBG Head Size Influence on Localized On-Chip Thermal Measurement in IGBT Power Modules. IEEE Sensors Journal, 2022.
4. Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology - Sensing Head Interfacing. IEEE Sensors Journal, 2022.
5. An ON-State Voltage Calculation Scheme of MMC Submodule IGBT. IEEE Transactions on Power Electronics, 2019.
6. Direct sensing of IGBT junction temperature using silicone GEL bonded FBG sensors. 12th Int. Conf. on Power Electronics, Machines and Drives, 2023.
7. Detection of series DC arc fault using rogowski coil. 2017 IEEE Conf. on Electrical Insulation and Dielectric Phenomenon, 2017.
1. 一种模块化多电平换流器子模块电容器的在线监测方法
2. 柔性直流输电模块化多电平换流器子模块IGBT的在线监测方法
1.硕士研究生招生，2025，电力电子、电气工程、控制科学与工程，控制科学与工程学院，1
