本人长期从事功率半导体器件与装备状态监测与健康管理技术研究。在IEEE TPEL等旗舰期刊及会议发表论文15篇(一作/通讯9篇),获授权国家发明专利2项,入选山东省优秀青年科学基金(海外),主持省部级基金项目2项。
1. 功率器件热电参量感知与老化评估
2. 氮化镓芯片先进驱动与电磁干扰抑制
3. 多电平换流器状态感知与热设计优化
1. A Comparison of Chip Temperature Acquisition Technologies of IGBT Power Modules. IEEE Sensors Journal, 2024.
2. Direct On-Chip IGBT Thermal Sensing Using Adhesive Bonded FBG Sensors. IEEE Sensors Journal, 2023.
3. FBG Head Size Influence on Localized On-Chip Thermal Measurement in IGBT Power Modules. IEEE Sensors Journal, 2022.
4. Direct on Chip Thermal Measurement in IGBT Modules Using FBG Technology - Sensing Head Interfacing. IEEE Sensors Journal, 2022.
5. An ON-State Voltage Calculation Scheme of MMC Submodule IGBT. IEEE Transactions on Power Electronics, 2019.
6. Direct sensing of IGBT junction temperature using silicone GEL bonded FBG sensors. 12th Int. Conf. on Power Electronics, Machines and Drives, 2023.
7. Detection of series DC arc fault using rogowski coil. 2017 IEEE Conf. on Electrical Insulation and Dielectric Phenomenon, 2017.
1. 一种模块化多电平换流器子模块电容器的在线监测方法
2. 柔性直流输电模块化多电平换流器子模块IGBT的在线监测方法
1.硕士研究生招生,2027,电力电子、电气工程、控制科学与工程,控制科学与工程学院,1