Project Name: : 基于柔性薄膜的6G太赫兹芯片与三维电路集成的研究

Affiliation of Participant(s): : 集成电路学院

Leading Scientist: : 张翼飞

Nature of Project: : 纵向

Project level: : 省、部委级

Project Number: : 1BB28A0F56363FC6E063BE07C2CA33FE

Date of Project Approval: : 2024-01-01

Scheduled completion time: : 2026-12-31

Date of Project Completion: : 2026-12-31

Date of Project Initiation: : 2024-01-01

Project Approval Number: : ZR2023ZD08-1