Affiliation of Author(s): : 材料科学与工程学院

Title of Paper: : A novel heat-resistant Al-Si-Cu-Ni-Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons

Journal: : Journal of Materials Science and Technology

First Author: : 胡恺琪

Document Code: : 61123AC82B7544CBBD7FA5B5309ED7E6

Volume: : 35

Issue: : 3

Page Number: : 306

Number of Words: : 4

Translation or Not: : no

Date of Publication: : 2019-03-01