孙谦谦
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A novel heat-resistant Al-Si-Cu-Ni-Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons
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Institution:材料科学与工程学院

Title of Paper:A novel heat-resistant Al-Si-Cu-Ni-Mg base material synergistically strengthened by Ni-rich intermetallics and nano-AlNp microskeletons

Journal:Journal of Materials Science and Technology

First Author:胡恺琪

Document Code:61123AC82B7544CBBD7FA5B5309ED7E6

Volume:35

Issue:3

Page Number:306

Number of Words:4

Translation or Not:No

Date of Publication:2019-03

Release Time:2021-06-01

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Gender : Male

School/Department : 材料科学与工程学院

Faculty/School : School of Materials Science & Engineering

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